i ntegrated c ircuits d ivision www.ixysic.com ds-laa108-r04 1 laa108 dual single-pole, normally open optomos ? relay e 3 pb part # description laa108 8-pin dip (50/tube) laa108s 8-pin surface mount (50/tube) laa108str 8-pin surface mount (1,000/reel) laa108p 8-pin flat pack (50/tube) LAA108PTR 8-pin flat pack (1,000/reel) parameter ratings units blocking voltage 100 v p load current 300 ma rms / ma dc on-resistance (max) 8 ? applications features description approvals ordering information pin configuration switching characteristics of normally open (form a) devices form-a i f i load 10% 90% t on t off ? 3750v rms input/output isolation ? low drive power requirements (ttl/cmos compatible) ? high reliability ? arc-free with no snubbing circuits ? fcc compatible ? vde compatible ? no emi/rfi generation ? small 8-pin package ? machine insertable, wave solderable ? surface mount tape & reel versions available ? instrumentation ? multiplexers ? data acquisition ? electronic switching ? i/o subsystems ? meters (watt-hour, water, gas) ? medical equipment-patient/equipment isolation ? security ? aerospace ? industrial controls ixys integrated circuits division's laa108 is a 100v, 300ma, 8 ? dual single-pole, normally open (1-form-a) solid state relay that has two independently controlled, optically coupled outputs. the output mosfet switches and photovoltaic die employ optically coupled mosfet technology to provide 3750 v rms of input-to-output isolation. the relay outputs, that use patented optomos architecture, are controlled by a highly efficient gaalas infrared led. this dual single-pole optomos relay provides a more compact design solution than two discrete single-pole relays in a variety of applications, saving board space by incorporating both switches in a single 8-pin package. ? ul certified component: file e76270 ? csa certified component: certificate 1175739 ? en/iec 60950-1 certified component: tuv certificate b 10 05 49410 006 1 2 3 4 8 7 6 5 + control - switch #1 C control - switch #1 + control - switch #2 C control - switch #2 load - switch #1 load - switch #1 load - switch #2 load - switch #2
i ntegrated c ircuits d ivision www.ixysic.com 2 r04 laa108 absolute maximum ratings are stress ratings. stresses in excess of these ratings can cause permanent damage to the device. functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. parameter conditions symbol min typ max units output characteristics load current continuous 1 -i l - - 300 ma rms / ma dc peak t =10ms i lpk - - 400 ma p on-resistance 2 i l =300ma r on - 4.5 8 ? off-state leakage current v l =100v p i leak --1 ? a switching speeds turn-on i f =5ma, v l =10v t on - 0.43 3 ms turn-off t off - 0.17 3 output capacitance v l =50v, f=1mhz c out - 110 - pf input characteristics input control current to activate 3 i l =300ma i f - 0.5 2 ma input control current to deactivate - - 0.2 0.3 - ma input voltage drop i f =5ma v f 0.9 1.2 1.4 v reverse input current v r =5v i r --10 ? a common characteristics input to output capacitance - c i/o -3- pf 1 if both poles operate simultaneously, the load current must be derated so as not to exceed the package total power dissipatio n value. 2 measurement taken within one (1) second of on-time. 3 for applications requiring high-temperature operation (t>60oc), a led drive currrent of 4ma is recommended. parameter ratings units blocking voltage 100 v p reverse input voltage 5 v input control current 50 ma peak (10ms) 1 a input power dissipation 1 150 mw total power dissipation 2 800 mw isolation voltage, input to output 3750 v rms operational temperature -40 to +85 c storage temperature -40 to +125 c 1 derate linearly 1.33 mw / c 2 derate linearly 6.67 mw / c absolute maximum ratings @ 25c electrical characteristics @ 25oc (unless otherwise noted)
i ntegrated c ircuits d ivision laa108 www.ixysic.com 3 r04 performance data@ 25oc (unless otherwise noted)* *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written speci? cations, please contact our application department. led forward voltage (v) 1.26 1.27 1.28 1.29 1.30 1.31 device count (n) 0 5 10 15 20 25 30 led forward voltage distribution (i f =5ma) turn-on time (ms) 0.135 0.150 0.165 0.180 0.195 0.210 0.225 device count (n) 0 5 10 15 20 turn-on time distribution (i f =5ma, i l =200ma) turn-off time (ms) 0.34 0.38 0.42 0.46 0.50 0.54 0.58 device count (n) 0 5 10 15 20 25 turn-off time distribution (i f =5ma, i l =200ma) 0.40 0.45 0.50 0.55 0.60 0.65 0.70 device count (n) 0 5 10 15 20 led current to operate distribution (i l =100ma) led current to operate (ma) on-resistance ( : ) 4.46 4.48 4.50 4.52 4.54 4.56 4.58 device count (n) 0 5 10 15 20 on-resistance distribution (i f =2ma, i l =200ma) blocking voltage (v p ) 139 140 141 142 143 144 device count (n) 0 5 10 15 20 25 blocking voltage distribution -40 -20 0 20 40 60 80 100 1.0 1.1 1.2 1.3 1.4 1.5 1.6 temperature (oc) led forward voltage (v) led forward voltage vs. temperature i f =20ma i f =50ma i f =5ma i f =10ma i f =2ma led forward current (ma) 0 1020304050 turn-on time (ms) 0 0.1 0.2 0.3 0.4 0.5 turn-on time vs. led forward current (i l =80ma) led forward current (ma) 0 1020304050 turn-off time (ms) 0.425 0.430 0.435 0.440 0.445 0.450 turn-off time vs. led forward current (i l =80ma) temperature (oc) -40 -20 0 20 40 60 80 100 led current (ma) 0.45 0.50 0.55 0.60 0.65 0.70 0.75 0.80 led current to operate vs. temperature (i l =100ma) temperature (oc) -40 -20 0 20 40 60 80 100 turn-on time (ms) 0.14 0.16 0.18 0.20 0.22 0.24 0.26 turn-on time vs. temperature (i f =5ma, i l =80ma) temperature (oc) -40 -20 0 20 40 60 80 100 turn-off time ( m s) 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 0.65 turn-off time vs. temperature (i f =5ma, i l =80ma)
i ntegrated c ircuits d ivision www.ixysic.com 4 r04 laa108 performance data@ 25oc (unless otherwise noted)* *the performance data shown in the graphs above is typical of device performance. for guaranteed parameters not indicated in t he written speci? cations, please contact our application department. temperature (oc) -40 -20 0 20 40 60 80 100 on-resistance ( : ) 4.0 4.5 5.0 5.5 6.0 6.5 on-resistance vs. temperature (i f =2ma, i l =200ma) load voltage (v) -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3 load current (ma) -0.6 -0.4 -0.2 0.0 0.2 0.4 0.6 typical load current vs. load voltage (i f =2ma) temperature (oc) -40 -20 0 20 40 60 80 100 load current (ma) 100 150 200 250 300 350 400 450 500 maximum load current vs. temperature (i f =5ma) single pole operating total current - both poles operating * * neither pole to exceed single pole limits temperature (oc) -40 -20 0 20 40 60 80 100 blocking voltage (v p ) 134 136 138 140 142 144 146 148 150 blocking voltage vs. temperature temperature (oc) -40 -20 0 20 40 60 80 100 leakage (na) 0 5 10 15 20 25 leakage current vs. temperature measured across pins 5 & 6, 7 & 8 (v l =100v) time 10 p s 100 p s 1ms 10ms 100ms 1s 10s 100s load curent (a) energy rating curve (single pole, i f =5ma) 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0.2
i ntegrated c ircuits d ivision laa108 www.ixysic.com 5 r04 manufacturing information moisture sensitivity all plastic encapsulated semiconductor packages are susceptible to moisture ingression. ixys integrated circuits division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . device moisture sensitivity level (msl) rating laa108 / laa108s / laa108p msl 1 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . reflow profile this product has a maximum body temperature and time rating as shown below. all other guidelines of j-std-020 must be observed. device maximum temperature x time laa108 / laa108s 250oc for 30 seconds laa108p 260oc for 30 seconds board wash ixys integrated circuits division recommends the use of no-clean flux formulations. however, board washing to remove flux residue is acceptable. since ixys integrated circuits division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. chlorine- or fluorine-based solvents or fluxes should not be used. cleaning methods that employ ultrasonic energy should not be used. e 3 pb
i ntegrated c ircuits d ivision www.ixysic.com 6 r04 laa108 mechanical dimensions laa10 8 laa10 8 s laa10 8 p dimensions mm (inches) pcb hole pattern 2.540 0.127 (0.100 0.005) 6.350 0.127 (0.250 0.005) 9.144 0.508 (0.360 0.020) 0.457 0.076 (0.018 0.003) 9.652 0.381 (0.380 0.015) 7.239 typ. (0.285) 7.620 0.254 (0.300 0.010) 4.064 typ (0.160) 0.813 0.102 (0.032 0.004) 8-0.800 dia. (8-0.031 dia.) 2.540 0.127 (0.100 0.005) 7.620 0.127 (0.300 0.005) 7.620 0.127 (0.300 0.005) 6.350 0.127 (0.250 0.005) 3.302 0.051 (0.130 0.002) pin 1 0.254 0.0127 (0.010 0.0005) dimensions mm (inches) pcb land pattern 9.398 0.127 (0.370 0.005) 6.350 0.127 (0.250 0.005) 2.540 0.127 (0.100 0.005) 7.620 0.254 (0.300 0.010) 0 min / 0.102 max (0 min / 0.004 max) 2.286 max. (0.090 max.) 0.203 0.013 (0.008 0.0005) 0.635 0.127 (0.025 0.005) 9.652 0.381 (0.380 0.015) 0.457 0.076 (0.018 0.003) 2.159 0.025 (0.085 0.001) 2.54 (0.10) 8.70 (0.3425) 1.55 (0.0610) 0.65 (0.0255) 0.864 0.120 (0.034 0.004) pin 1 dimensions mm (inches) pcb land pattern 2.540 0.127 (0.100 0.005) 9.652 0.381 (0.380 0.015) 6.350 0.127 (0.250 0.005) 9.525 0.254 (0.375 0.010) 0.457 0.076 (0.018 0.003) 0.813 0.102 (0.032 0.004) 4.445 0.127 (0.175 0.005) 7.620 0.254 (0.300 0.010) 0.635 0.127 (0.025 0.005) 0.254 0.0127 (0.010 0.0005) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302 0.051 (0.130 0.002) pin 1
i ntegrated c ircuits d ivision for additional information please visit our website at: www.ixysic.com 7 laa108 ixys integrated circuits division makes no representations or warranties with respect to the accuracy or completeness of the co ntents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity a re expressed or implied. except as set forth in ixys integrated circuits division?s standard terms and conditions of sale, ixys integrated circuits division assumes no liability whatsoever, a nd disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringem ent of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of ixys integrated circuits division?s product may resul t in direct physical harm, injury, or death to a person or severe property or environmental damage. ixys integrated circuits division reserves the right to discontinue or make changes to its p roducts at any time without notice. specification: ds-laa108-r04 ?copyright 2012, ixys integrated circuits division optomos ? is a registered trademark of ixys integrated circuits division all rights reserved. printed in usa. 12/19/2012 mechanical dimensions laa10 8 str tape & reel laa10 8 ptr tape & reel dimensions mm (inches) user direction of feed notes: 1. dimensions carry tolerances of eia standard 481-2 2. tape complies with all notes for constant dimensions listed on page 5 of eia-481-2 embossment embossed carrier top cover tape thickness 0.102 max. (0.004 max.) 330.2 dia. (13.00 dia.) k 1 =4.20 (0.165) 0 k =4.90 (0.193) p=12.00 (0.472) w=16.00 (0.63) bo=10.30 (0.406) ao=10.30 (0.406) dimensions mm (inches) notes: 1. all dimensions carry tolerances of eia standard 481-2 2. the tape complies with all notes for constant dimensions listed on page 5 of eia-481-2 embossment embossed carrier top cover tape thickness 0.102 max. (0.004 max.) 330.2 dia. (13.00 dia.) user direction of feed p = 12.00 (0.472) w = 16.00 (0.63) bo = 10.30 (0.406) ao = 10.30 (0.406) k 1 = 2.00 (0.079) k 0 = 2.70 (0.106) 7.50 (0.295) 2.00 (0.079) 4.00 (0.157)
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